Fusen Ernie Chen (Chief Executive Officer, President, and Director)
J. Michael Dodson (Chief Financial Officer, Chief Operating Officer)

Mattson Technology Inc (NASDAQ:MTSN) is an American technology company which was founded in 1988 by Brad Mattson and is based in Fremont, California. The company is both a manufacturer and supplier in the market of semiconductor equipment globally. Its main products are dry strip system, rapid thermal processing, and etching. The company provides products for customers and manufacturers; such as foundries, memory and logic devices.

The main offices for Mattson served as the filming location for Cyberdyne Systems from Terminator 2: Judgment Day.

The company’s major products are semiconductor wafer processing equipment used in the fabrication of integrated circuits (ICs). Its dry strip products (SUPREMA) incorporates its Faraday shielded inductively coupled plasma (ICP) radio frequency source and platform used in the production at the 65 nanometer node and below. In addition, its rapid thermal processing (RTP) products (Helios, Helios XP and Millios) are used in annealing applications. These products use dual-sided, lamp-based heating technology to control the chip manufacturing. Its etch products (paradigmE and Alpine) with a combination of Faraday-shielded ICP and etch bias control for on-wafer performance. Etching is the process of removing any deposited materials or layers from the wafer's surface to create the desired pattern on the wafer's surface.

In May 2016, Mattson Technology and Beijing ETOWN ("E-Town Dragon") jointly announced that the previously announced acquisition of Mattson by E-Town had been completed.

Mattson Technology is one of the leaders in the dry strip market and is the second largest supplier of RTP products. There are several important technologies widely used in its products, namely 45 nm transition; (Etch) Alpine, paradigm Si; (Strip) SUPREMA, SUPREMA XP5; (TPG) Helios, Helios XP, Millios.

In December 2013, Mattson Technology announced its paradigmE XP, next-generation etch system, extending the company's etch technology and enabling chipmakers to address processing challenges for leading-edge, three-dimensional semiconductor manufacturing. This new system has been qualified in Nov. by advanced DRAM device technologies.